ADPA7005CHIP datasheet(16/23 Pages) AD

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ADPA7005CHIP

Data Sheet

Rev. 0 | Page 16 of 23

Figure 53. High Frequency Output Wideband Matching

Handling Precautions

To avoid permanent damage, follow these storage, cleanliness,

static sensitivity, transient, and general handling precautions:

•

Place all bare die in either waffle or gel-based ESD protective

containers and then seal the die in an ESD protective bag for

shipment. After the sealed ESD protective bag is opened, store

all die in a dry nitrogen environment.

•

Handle the chips in a clean environment. Do not attempt

to clean the chip using liquid cleaning systems.

•

Follow ESD precautions to protect against ESD strikes.

•

While bias is applied, suppress instrument and bias supply

transients. Use shielded signal and bias cables to minimize

inductive pickup.

•

Handle the chip along the edges with a vacuum collet or

with a sharp pair of tweezers. The surface of the chip has

fragile air bridges and must not be touched with a vacuum

collet, tweezers, or fingers.

Mounting

Before the epoxy die is attached, apply a minimum amount of

epoxy to the mounting surface so that a thin epoxy fillet is

observed around the perimeter of the chip after the chip is

placed into position. Cure the epoxy per the schedule of the

manufacturer.

Wire Bonding

RF bonds made with 3 mil × 0. 5 mil gold ribbon

are recommended for the RF ports. These bonds must

be thermosonically bonded with a force of 40 g to 60 g.

Thermosonically bonded dc bonds of 0.025 mm diameter,

are recommended. Create ball bonds with a force of 40 g to 50 g

and wedge bonds with a force of 18 g to 22 g. Create all bonds

with a nominal stage temperature of 150°C. Apply the minimum

amount of ultrasonic energy (depending on the process and

package being used) to achieve reliable bonds. Keep all bonds as

short as possible, less than 0.31 mm.

Alternatively, short RF bonds that are ≤3 mm and made with

two 1 mm wires can be used.

MMIC

PCB BOARD

50Ω

TRANSMISSION LINE

MATCHING STUB/BONDPAD

SHUNT CAPACITANCE = 15fF

3mil GOLD

RIBBON

ilGA

RFOUT

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