MPC7441 datasheet(46/56 Pages) NXP

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MPC7447A RISC Microprocessor Hardware Specifications, Rev. 5

Freescale Semiconductor

System Design Information

the selection of any thermal interface material depends on many factors—thermal performance

requirements, manufacturability, service temperature, dielectric properties, cost, and so on.

Figure 23. Thermal Performance of Select Thermal Interface Material

The board designer can choose between several types of thermal interface. Heat sink adhesive materials

should be selected based on high conductivity and mechanical strength to meet equipment shock/vibration

requirements. There are several commercially available thermal interfaces and adhesive materials

provided by the following vendors:

The Bergquist Company

800-347-4572

18930 West 78th St.

Chanhassen, MN 55317

Internet: www.bergquistcompany.com

Chomerics, Inc.

781-935-4850

77 Dragon Ct.

Woburn, MA 01801

Internet: www.chomerics.com

Dow-Corning Corporation

800-248-2481

Dow-Corning Electronic Materials

2200 W. Salzburg Rd.

Midland, MI 48686-0997

Internet: www.dowcorning.com

0.5

1.5

1020

50607080

Silicone Sheet (0.006 in.)

Bare Joint

Fluoroether Oil Sheet (0.007 in.)

Graphite/Oil Sheet (0.005 in.)

Synthetic Grease

Contact Pressure (psi)

MPC7441 数据表(PDF) 46 Page - NXP Semiconductors

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