MPC7441 datasheet(11/56 Pages) NXP

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MPC7447A RISC Microprocessor Hardware Specifications, Rev. 5

Freescale Semiconductor

Electrical and Thermal Characteristics

Table 4 provides the recommended operating conditions for the MPC7447A.

NOTE

Table 4 describes the nominal operating conditions of the device. For

information regarding the operation of the device at supported derated core

voltage conditions, see Section 5.3, “Voltage and Frequency Derating.”

Table 5 provides the package thermal characteristics for the MPC7447A.

Table 3. Input Threshold Voltage Settings

BVSEL Signal

Processor Bus Input Threshold is Relative to:

Notes

1.8 V

1, 2

¬HRESET

Not available

HRESET

2.5 V

12.5 V

Notes:

1. Caution: The input threshold selection must agree with the OVDD voltages supplied. See notes in Table 2.

2. If used, pull-down resistors should be less than 250

Ω.

Table 4. Recommended Operating Conditions1

Characteristic

Symbol

Recommended Value

Unit

Notes

Minimum

Maximum

Core supply voltage

VDD

1.3 V ± 50 mV

PLL supply voltage

AVDD

1.3 V ± 50 mV

2, 3

Processor bus supply voltage

BVSEL = 0

OVDD

1.8 V ± 5%

BVSEL = HRESET or OVDD

OVDD

2.5 V ± 5%

Input voltage

Processor bus

Vin

GND

OVDD

JTAG signals

Vin

GND

OVDD

Die-junction temperature

0105

°C

Notes:

1. These are the recommended and tested operating conditions. In addition, these devices also support voltage

derating; see Section 5.3, “Voltage and Frequency Derating.” Proper device operation outside of these conditions

and those specified in Section 5.3 is not guaranteed.

2. This voltage is the input to the filter discussed in Section 9.2, “PLL Power Supply Filtering,” and not necessarily the

voltage at the AVDD pin, which may be reduced from VDD by the filter.

3. VDD and AVDD may be reduced in order to reduce power consumption if further maximum core frequency

constraints are observed. See Section 5.3, “Voltage and Frequency Derating,” for specific information.

Table 5. Package Thermal Characteristics1

Characteristic

Symbol

Value

Unit

Notes

Junction-to-ambient thermal resistance, natural convection, single-layer (1s) board

RθJA

°C/W

2, 3

Junction-to-ambient thermal resistance, natural convection, four-layer (2s2p) board

RθJMA

°C/W

2, 4

Junction-to-ambient thermal resistance, 200 ft/min airflow, single-layer (1s) board

RθJMA

°C/W

2, 4

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