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2021 Microchip Technology Inc.

DS20006510B-page 9

VC-830

4.0

RELIABILITY

Microchip qualification will include aging at various extreme temperatures, shock and vibration, temperature cycling, and

IR reflow simulation. The VC-830 family is capable of meeting the following qualification tests.

5.0

IR REFLOW

Devices are built using lead-free epoxy and can be subjected to standard lead-free IR reflow conditions shown in

Table 5-1. Contact pads are gold over nickel and lower maximum temperatures can also be used, such as 220°C.

FIGURE 5-1:

Solder Profile.

TABLE 4-1:

ENVIRONMENTAL COMPLIANCE

Parameter

Conditions

Mechanical Shock

MIL-STD-883, Method 2002

Mechanical Vibration

MIL-STD-883, Method 2007

Temperature Cycle

MIL-STD-883, Method 1010

Solderability

MIL-STD-883, Method 2003

Gross and Fine Leak

MIL-STD-883, Method 1014

Resistance to Solvents

MIL-STD-883, Method 2015

Moisture Sensitivity Level

MSL 1

Contact Pads

Gold (0.3 µm min., 1.0 µm max.) over Nickel

28°C/W

Maximum Junction Temperature

150°C

Weight

23 mg

TABLE 5-1:

REFLOW PROFILE

Parameter

Symbol

Value

Pre-Heat Time

200 seconds maximum

Ramp Up

3°C/sec. maximum

Time above 217°C

150 seconds maximum

Time to Peak Temperature

480 seconds maximum

Time at 260°C

30 seconds maximum

Time at 240°C

60 seconds maximum

Ramp Down

6°C/sec. maximum