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SAMA5D2 数据表(PDF) 46 Page - Microchip Technology |
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SAMA5D2 数据表(HTML) 46 Page - Microchip Technology |
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46 / 56 page ![]() For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging Note: REF: Reference Dimension, usually without tolerance, for information purposes only. BSC: Basic Dimension. Theoretically exact value shown without tolerances. Notes: 1. 2. Pin 1 visual index feature may vary, but must be located within the hatched area. Dimensioning and tolerancing per ASME Y14.5M Number of Terminals Overall Height Terminal Width Overall Width Overall Pitch Pitch Standoff Units Dimension Limits A1 A b E1 e E N 0.80 BSC 0.38 - 0.27 - - - 16.00 BSC MILLIMETERS MIN NOM 361 0.48 1.20 0.37 MAX Overall Length Overall Pitch D D1 16.00 BSC 14.40 BSC 14.40 BSC Microchip Technology Drawing C04-21149-DYB Rev A Sheet 2 of 2 361-Ball Thin Fine Pitch Ball Grid Array (DYB) - 16x16 mm Body [TFBGA] Atmel Legacy Global Package Code CEP SAMA5D2 SIP Mechanical Characteristics © 2021 Microchip Technology Inc. Datasheet DS60001484D-page 46 |
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