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SAMA5D2 数据表(PDF) 49 Page - Microchip Technology |
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SAMA5D2 数据表(HTML) 49 Page - Microchip Technology |
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49 / 56 page ![]() Table 9-3. Package Reference JEDEC Drawing Reference NA J-STD-609 Classification e8 Table 9-4. 289-ball TFBGA Package Information Ball Land 0.450 mm ±0.05 Nominal Ball Diameter 0.4 mm Solder Mask Opening 0.350 mm ±0.05 Solder Mask Definition SMD Solder OSP 9.3 196-ball TFBGA For mechanical characteristics of the 196-ball TFBGA package, refer to the SAMA5D2 Series data sheet, ref. no. DS60001476, available on www.microchip.com. Note: The weight of the SAMA5D2 SIP is not the same as the weight of SAMA5D2. The SIP weight is given below: Table 9-5. Device and 196-ball TFBGA Package Weight Device Weight (mg) ATSAMA5D225C-D1M (128 Mb) 240 SAMA5D2 SIP Mechanical Characteristics © 2021 Microchip Technology Inc. Datasheet DS60001484D-page 49 |
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