ADUCM4050BCPZ-R7 datasheet(45/46 Pages) AD

45 / 46 page

Data Sheet

ADuCM4050

Rev. A | Page 45 of 46

OUTLINE DIMENSIONS

0.530

0.470

0.410

3.61

3.57

3.53

3.20

3.16

3.12

BOTTOM VIEW

(BALL SIDE UP)

TOP VIEW

(BALL SIDE DOWN)

SIDE VIEW

0.210

0.180

0.150

0.320

0.290

0.260

0.280

0.240

0.200

2.45 REF

2.80 REF

0.35

BALL PITCH

0.385

0.355

COPLANARITY

0.05

BALL A1

IDENTIFIER

SEATING

PLANE

Figure 29. 72-Ball Wafer Level Chip Scale Package [WLCSP]

(CB-72-3)

Dimensions shown in millimeters

0.30

0.25

0.18

0.80

0.75

0.70

0.50

BSC

BOTTOM VIEW

TOP VIEW

6.30

6.20 SQ

6.10

0.05 MAX

0.02 NOM

0.203 REF

COPLANARITY

0.08

9.10

9.00 SQ

8.90

FOR PROPER CONNECTION OF

THE EXPOSED PAD, REFER TO

THE PIN CONFIGURATION AND

FUNCTION DESCRIPTIONS

SECTION OF THIS DATA SHEET.

0.20 MIN

7.50 REF

COMPLIANT TO JEDEC STANDARDS MO-220-WMMD

0.45

0.40

0.35

EXPOSED

PAD

END VIEW

DETAIL A

(JEDEC 95)

P IN 1

IN D IC AT O R AR E A OP T IO N S

(SEE DETAIL A)

PIN 1

INDICATOR

AREA

SEATING

PLANE

Figure 30. 64-Lead Lead Frame Chip Scale Package [LFCSP]

9 mm × 9 mm Body and 0.75 mm Package Height

(CP-64-17)

Dimensions shown in millimeters

ADUCM4050BCPZ-R7 数据表(PDF) 45 Page - Analog Devices

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