ADP5302

Data Sheet

Rev. B | Page 22 of 22

OUTLINE DIMENSIONS

2.48

2.38

2.23

0.50

0.40

0.30

10

1

6

5

0.30

0.25

0.20

0.80

0.75

0.70

1.74

1.64

1.49

0.20 REF

0.05 MAX

0.02 NOM

0.50 BSC

EXPOSED

PAD

3.10

3.00 SQ

2.90

COPLANARITY

0.08

TOP VIEW

SIDE VIEW

BOTTOM VIEW

0.20 MIN

FOR PROPER CONNECTION OF

THE EXPOSED PAD, REFER TO

THE PIN CONFIGURATION AND

FUNCTION DESCRIPTIONS

SECTION OF THIS DATA SHEET.

P IN 1

IN D IC ATO R AR E A OP T IO N S

(SEE DETAIL A)

DETAIL A

(JEDEC 95)

PIN 1

INDICATOR

AREA

SEATING

PLANE

Figure 45. 10-Lead Lead Frame Chip Scale Package [LFCSP]

3 mm × 3 mm Body and 0.75 mm Package Height

(CP-10-9)

Dimensions shown in millimeters

ORDERING GUIDE

Temperature Range

Package Description

Package Option

Marking Code

ADP5302ACPZ-1-R7

−40°C to +125°C

10-Lead LFCSP Package

CP-10-9

LT7

ADP5302ACPZ-2-R7

−40°C to +125°C

10-Lead LFCSP Package

CP-10-9

LT8

ADP5302ACPZ-3-R7

−40°C to +125°C

10-Lead LFCSP Package

CP-10-9

LTD

ADP5302-EVALZ

Evaluation Board

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registered trademarks are the property of their respective owners.

D13443-0-9/19(B)