ADP5135ACPZ-R7 datasheet(5/24 Pages) AD

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Data Sheet

ADP5135

Rev. 0 | Page 5 of 24

ABSOLUTE MAXIMUM RATINGS

Table 5.

Parameter

Rating

AVIN to AGND

−0.3 V to +6 V

VIN1, VIN2, VIN3 to AVIN

−0.3 V to +0.3 V

PGND1, PGND2, PGND3 to AGND

−0.3 V to +0.3 V

VOUT1, VOUT2, VOUT3, FB1, FB2, FB3,

EN1, EN2, EN3, MODE, PG1, PG2, PG3

to AGND

−0.3 V to (AVIN + 0.3 V)

SW1 to PGND1

−0.3 V to (VIN1 + 0.3 V)

SW2 to PGND2

−0.3 V to (VIN2 + 0.3 V)

SW3 to PGND3

−0.3 V to (VIN3 + 0.3 V)

Storage Temperature Range

−65°C to +150°C

Operating Junction Temperature Range

−40°C to +125°C

Soldering Conditions

JEDEC J-STD-020

Stresses at or above those listed under Absolute Maximum

Ratings may cause permanent damage to the product. This is a

stress rating only; functional operation of the product at these

or any other conditions above those indicated in the operational

section of this specification is not implied. Operation beyond

the maximum operating conditions for extended periods may

affect product reliability.

For detailed information on power dissipation, see the Power

Dissipation and Thermal Considerations section.

THERMAL RESISTANCE

θJA is specified for the worst-case conditions, that is, a device

soldered in a circuit board for surface-mount packages.

Table 6. Thermal Resistance

Package Type

θJA

θJC

Unit

24-Lead LFCSP

°C/W

ESD CAUTION

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