6

Hardware design

The SPBT3.0DP2 module with Data Package embedded firmware supports UART, I²C and GPIO hardware

interfaces.

Note:

•

All unused pins (including the additional 6 pads on bottom side) should be left floating; do not ground.

•

All GND pins must be well grounded.

•

The area around the module should be free of any ground planes, power planes, trace routings, or metal for

6 mm from the module antenna position, in all directions.

•

Traces should not be routed under the module.

6.1

Reflow soldering

The SPBT3.0DP2 is a high temperature-strength surface-mount Bluetooth module supplied on a PCB with the

following characteristics: 18-pin, 6-layer. The recommended final assembly reflow profiles are indicated below.

The soldering phase must be executed with care. To prevent undesired melting, particular attention must be paid

to the setup of the peak temperature.

The following soldering indications are based on temperature profile recommendations.

Profile feature

PB-free assembly

3 °C/sec max

Preheat:

150 °C

200 °C

60-100 sec

Time maintained above:

217 °C

60-70 sec

240 + 0 °C

10-20 sec

Ramp-down rate

6 °C/sec

Time from 25 °C to peak temperature

8 minutes max.

SPBT3.0DP2

Hardware design

DS11599 - Rev 7

page 13/31