Contents

1

Applications .......................................................................3

2

Software architecture ..............................................................4

2.1

BT stack layers ................................................................ 4

2.2

Supported profile ............................................................... 5

2.3

AT command set: Data Package.................................................. 5

3

Module block diagram .............................................................6

4

Hardware specifications ...........................................................7

4.1

Recommended operating conditions .............................................. 7

4.2

Radio features ................................................................. 7

4.3

Absolute maximum ratings....................................................... 7

4.4

Current consumption ........................................................... 7

4.5

I/O operating characteristics ..................................................... 8

4.6

Pin assignment ................................................................ 9

5

Package information..............................................................11

5.1

RF module package information ................................................. 11

6

Hardware design .................................................................13

6.1

Reflow soldering .............................................................. 13

6.2

UART interface ............................................................... 14

6.3

GPIO interface................................................................ 15

6.4

Reset circuit .................................................................. 15

6.4.1

Simple external reset circuit ............................................... 15

6.4.2

Host controlled reset circuit ................................................ 16

6.5

External LPO input circuit....................................................... 16

6.6

MFi co-processor interface...................................................... 17

6.7

PCB layout guidelines.......................................................... 18

7

Firmware upgrade ................................................................20

7.1

Enter bootloader mode ......................................................... 20

7.2

Transfer the new firmware ...................................................... 20

7.3

Exit bootloader mode .......................................................... 20

SPBT3.0DP2

Contents

DS11599 - Rev 7

page 27/31