Data Sheet

ADP7112

Rev. D | Page 19 of 21

PCB LAYOUT CONSIDERATIONS

Heat dissipation from the package can be improved by increasing

the amount of copper attached to the pins of the ADP7112.

However, as listed in Table 6, a point of diminishing returns is

eventually reached, beyond which an increase in the copper size

does not yield significant heat dissipation benefits.

Place the input capacitor as close as possible to the VIN and

GND pins. Place the output capacitor as close as possible to the

VOUT and GND pins. Use of 0805 or 1206 size capacitors and

resistors achieves the smallest possible footprint solution on

boards where area is limited.

Figure 53. Example WLCSP PCB Layout