Data Sheet

ADP7112

Rev. D | Page 21 of 21

OUTLINE DIMENSIONS

A

B

C

0.560

0.500

0.440

0.330

0.300

0.270

0.230

0.200

0.170

0.990

0.950

0.910

1.200

1.160

1.120

1

2

BOTTOM VIEW

(BALL SIDE UP)

TOP VIEW

(BALL SIDE DOWN)

SIDE VIEW

0.300

0.260

0.220

0.80

REF

0.40

BSC

BALL A1

IDENTIFIER

SEATING

PLANE

0.40 BSC

COPLANARITY

0.04

Figure 54. 6-Ball Wafer Level Chip Scale Package [WLCSP]

1.00 mm × 1.20 mm Body

(CB-6-15)

Dimensions shown in millimeters

ORDERING GUIDE

Temperature Range

Package Description

Package Option

Branding

ADP7112ACBZ-1.2-R7

−40°C to +125°C

Adjustable (1.2)

6-Ball WLCSP

CB-6-15

CQ

ADP7112ACBZ-1.8-R7

−40°C to +125°C

1.8

6-Ball WLCSP

CB-6-15

CR

ADP7112ACBZ-2.5-R7

−40°C to +125°C

2.5

6-Ball WLCSP

CB-6-15

CS

ADP7112ACBZ-3.3-R7

−40°C to +125°C

3.3

6-Ball WLCSP

CB-6-15

CT

ADP7112ACBZ-5.0-R7

−40°C to +125°C

5.0

6-Ball WLCSP

CB-6-15

CU

ADP7112CB-EVALZ

3.3

WLCSP Evaluation Board

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registered trademarks are the property of their respective owners.

D12508-3/20(D)