ADP1764ACPZ-R7 datasheet(18/20 Pages) AD

18 / 20 page

ADP1764

Data Sheet

Rev. A | Page 18 of 20

140

1.4

VIN – VOUT (V)

100

120

0.2

0.4

0.6

0.8

1.0

1.2

0.1A

1.0A

2.0A

3.0A

4.0A

TJ MAX

Figure 53. 1000 mm2 of PCB Copper, TB = 50°C, LFCSP

140

1.4

VIN – VOUT (V)

100

120

0.2

0.4

0.6

0.8

1.0

1.2

0.1A

1.0A

2.0A

3.0A

4.0A

TJ MAX

Figure 54. 500 mm2 of PCB Copper, TB = 50°C, LFCSP

140

1.4

VIN – VOUT (V)

100

120

0.2

0.4

0.6

0.8

1.0

1.2

0.1A

1.0A

2.0A

3.0A

4.0A

TJ MAX

Figure 55. 100 mm2 of PCB Copper, TB = 50°C, LFCSP

TB = 91.7°C

TADP1764 = 109°C

Figure 56. Thermal Image of the ADP1764 Evaluation Board at ILOAD = 4 A,

VIN = 1.5 V, VOUT = 1.3 V, TB = 91.7°C

Figure 56 shows a thermal image of the ADP1764 evaluation

board operating at a 4 A current load. The total power dissipation

on the ADP1764 is 744 mW, which makes the temperature on

the surface of the device higher by 17.3°C than the temperature

of the evaluation board.

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