ADPA7008AEHZ-R7 datasheet(5/28 Pages) AD

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Data Sheet

ADPA7008

ABSOLUTE MAXIMUM RATINGS

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Rev. 0 | 5 of 28

Table 5.

Parameter

Rating

Drain Bias Voltage (VDDx)

6.0 V

VGGx

−1.6 V to 0 V

RF Input Power (RFIN)

22 dBm

Continuous Power Dissipation (PDISS), TA = 85°C (Derate

123 mW/°C Above 85°C)

11.1 W

Temperature

Maximum Channel to Maintain 1,000,000 Hour Mean

Time to Failure (MTTF)

175°C

Quiescent Channel (TJ = 85°C, VDD = 5 V, IDQ = 1500 mA) 130°C

Storage

−65°C to +150°C

Operating

−40°C to +85°C

Stresses at or above those listed under Absolute Maximum Ratings

may cause permanent damage to the product. This is a stress

rating only; functional operation of the product at these or any other

conditions above those indicated in the operational section of this

specification is not implied. Operation beyond the maximum operat-

ing conditions for extended periods may affect product reliability.

THERMAL RESISTANCE

Overall thermal performance is directly linked to printed circuit

board (PCB) design and operating environment. Careful attention to

PCB thermal design is required.

θJC is the channel to case thermal resistance (the channel to the

exposed metal ground pad on the underside of the device).

Table 6. Thermal Resistance

Package Type1

θJC

Unit

EH-18-1

Quiescent, TBASE = 85°C

6.0

°C/W

Worst Case2, TBASE = 85°C

8.1

°C/W

1 The thermal resistance varies with operating conditions.

2 The worst case across all specified operating conditions.

ELECTROSTATIC DISCHARGE (ESD) RATINGS

The following ESD information is provided for handling of ESD

sensitive devices in an ESD protected area only.

Human body model (HBM) per ANSI/ESDA/JEDEC JS-001.

ESD Ratings for ADPA7008

Table 7. ADPA7008, 18-Terminal LCC_HS

ESD Model

Withstand Threshold (V)

Class

HBM

±250

ESD CAUTION

ESD (electrostatic discharge) sensitive device. Charged devi-

ces and circuit boards can discharge without detection. Although

this product features patented or proprietary protection circuitry,

damage may occur on devices subjected to high energy ESD.

Therefore, proper ESD precautions should be taken to avoid

performance degradation or loss of functionality.

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