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MPC7410EC 数据表(PDF) 32 Page - NXP Semiconductors |
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MPC7410EC 数据表(HTML) 32 Page - NXP Semiconductors |
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32 / 56 page ![]() MPC7410 RISC Microprocessor Hardware Specifications, Rev. 6.1 32 Freescale Semiconductor Package Description 7.5 Package Parameters for the MPC7410, 360 HCTE_LGA The package parameters are as listed here. The package type is the 25 × 25 mm, 360 high coefficient of thermal expansion LGA package (HCTE_LGA). Package outline 25 × 25 mm Interconnects 360 (19 × 19 land array – 1) Pitch 1.27 mm (50 mil) Minimum module height 1.92 mm Maximum module height 2.20 mm Coefficient of thermal expansion 12.3ppm/°C |
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