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SWCS049G 数据表(PDF) 12 Page - Texas Instruments |
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SWCS049G 数据表(HTML) 12 Page - Texas Instruments |
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12 / 144 page  12 TPS65911 SWCS049S – JUNE 2010 – REVISED AUGUST 2018 www.ti.com Submit Documentation Feedback Product Folder Links: TPS65911 Specifications Copyright © 2010–2018, Texas Instruments Incorporated (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) I/O supplied from VRTC, but can be driven from VCC7 or to VCC7 voltage level. (3) Input supplied from VRTC, but can be driven from VCC7 voltage level. 5 Specifications 5.1 Absolute Maximum Ratings Over operating free-air temperature range (unless otherwise noted) (1) MIN MAX UNIT Voltage range on pins VCC1, VCC2, VCCIO, VCC3, VCC4, VCC5, VCC7, VBACKUP, V5IN, TRIP –0.3 7 V VCC6 –0.3 3.6 VDDIO –0.3 3.6 VBST –0.3 37 SW –5 30 SW1, SW2, SWIO –0.3 7 VFB1, VFB2, VFBIO –0.3 3.6 VOUT, VFB –0.3 7 OSC32KIN, OSC32KOUT, BOOT1 –0.3 VRTCMAX + 0.3 SDA_SDI, SCL_SCK, EN2, EN1, SLEEP, INT1, CLK32KOUT, NRESPWRON –0.3 VDDIOMAX + 0.3 PWRON –0.3 7 PWRHOLD, GPIO0 –0.3 7 Voltage range on pins GPIO1, GPIO2, GPIO3, GPIO4, GPIO5, GPIO6, GPIO7, GPIO8(2) –0.3 7 V HDRST –0.3 7 NRESPWRON2(2) –0.3 7 PWRDN(3) –0.3 7 VCCS –0.3 7 Peak output current on all other pins than power resources –5 5.0 mA Functional junction temperature –45 150 °C Storage temperature, Tstg –65 150 °C (1) JEDEC document JEP155 statues that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP155 statues that 250-V HBM allows safe manufacturing with a standard ESD control process. 5.2 ESD Ratings VALUE UNIT VESD Electrostatic discharge Human body model (HBM), per ANSI/ESDA/JEDEC JS001(1) ±2000 V Charged device model (CDM), per JESD22-C101(2) ±500 |
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