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AM6442...ALV 数据表(PDF) 232 Page - Texas Instruments |
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AM6442...ALV 数据表(HTML) 232 Page - Texas Instruments |
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232 / 244 page ![]() 9.3.5 High Speed Differential Signal Routing Guidance The High Speed Interface Layout Guidelines provides guidance for successful routing of the high speed differential signals. This includes PCB stackup and materials guidance as well as routing skew, length and spacing limits. TI supports only designs that follow the board design guidelines contained in the application report. 9.3.6 External Capacitors Note NOTE TO USERS: The content of this section is UNDER DEVELOPMENT! 9.3.7 Thermal Solution Guidance The Thermal Design Guide for DSP and ARM Application Processors provides guidance for successful implementation of a thermal solution for system designs containing this device. This document provides background information on common terms and methods related to thermal solutions. TI only supports designs that follow system design guidelines contained in the application report. AM6442, AM6441, AM6421, AM6412, AM6411 SPRSP56D – JANUARY 2021 – REVISED JULY 2022 www.ti.com 232 Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated Product Folder Links: AM6442 AM6441 AM6421 AM6412 AM6411 |
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