www.sensirion.com

Version 1.1 – April 2021

20/22

4.3 Tape & Reel Package

Figure 5: Technical drawing of the packaging tape with sensor orientation in tape. Header tape is to

the right and trailer tape to the left on this drawing. Dimensions are given in millimeters.

4.4 Moisture Sensitivity Level

Sensirion SCD4x sensors shall be treated according to Moisture Sensitivity Level 3 (MSL3) as described in IPC/JEDEC J-STD-

033B1. Exposure to moisture levels or solder reflow temperatures, which exceed the limits as stated in this document, can result

in yield loss and reliability degradation.

The manufacturing floor time (out of bag) at the customer’s end is 168 hours at normal factory conditions (≤30°C and 60%RH).

If sensors are not mounted within this time, or have been exposed to higher temperatures and humidity (>30°C and >60%RH),

or there is any doubt about the airtight integrity of the dry pack, the parts should be baked (baking parameters see Table 32).

The maximum allowed baking temperature is 40°C if the sensors are inside the reel.

Table 32: Baking condition SCD4x if floor time (168 h) with open bag is exceeded.

SCD4x package type

Baking temperature

Min. baking time

Baking condition

Sensors removed from tape

90 °C

48 hours

RH < 5 %

Sensors in tape

40 °C

23 days

RH < 5 %