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SCD40-D-R2 数据表(PDF) 5 Page - Sensirion AG Switzerland |
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SCD40-D-R2 数据表(HTML) 5 Page - Sensirion AG Switzerland |
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5 / 22 page ![]() www.sensirion.com Version 1.1 – April 2021 5/22 2.3 Interface Specifications The SCD4x comes in an LGA package (Table 6). The package outline is schematically displayed in chapter 4.1. The landing pattern of the SCD4x can be found in chapter 4.2. Name Comments VDD Supply voltage VDDH Supply voltage IR source, must be connected to VDD on customer PCB GND Ground contact SDA I2C Serial data, bidirectional SCL I2C Serial clock DNC Do not connect, pads must be soldered to a floating pad on the customer PCB Table 6 Pin assignment (top view). The notched corner of the protection membrane serves as a polarity mark to indicate pin 1 location. VDD and VDDH are used to supply the sensor and must always be kept at the same voltage, i.e. should both be connected to the same power supply. The combined maximum current drawn on VDD and VDDH is indicated in Table 4. Care should be taken to choose a low noise power supply (preferably a low-dropout regulator, LDO, with output ripple of less than 30 mV p-p), which is adequately dimensioned for the relatively large peak currents. Power supply configurations with large transient voltage drops are to be avoided to ensure proper sensor operation. SCL is used to synchronize the I2C communication between the master (microcontroller) and the slave (sensor). The SDA pin is used to transfer data to and from the sensor. For safe communication, the timing specifications defined in the I2C manual12 must be met. Both SCL and SDA lines should be connected to external pull-up resistors (e.g. Rp = 10 kΩ, see Figure 1). To avoid signal contention, the microcontroller must only drive SDA and SCL low. For dimensioning resistor sizes please take bus capacity and communication frequency into account (see example in Section 7.1 of NXPs I2C Manual for more details10). It should be noted that pull-up resistors may be included in I/O circuits of microcontrollers. Figure 1: Typical application circuit (for better clarity in the image, the positioning of the pins does not reflect the positions on the real sensor). VDD and VDDH must be connected to each other close to the sensor on the customer PCB. 12 http://www.nxp.com/documents/user_manual/UM10204.pdf |
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