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L99MOD51XP 数据表(PDF) 7 Page - STMicroelectronics |
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L99MOD51XP 数据表(HTML) 7 Page - STMicroelectronics |
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7 / 33 page ![]() DS12667 Rev 6 7/33 L99MOD51XP Block diagram and pin description 32 Figure 2. Configuration diagram (top view) Table 2. Pin definitions and functions Pin Symbol Function 1, 18, 19, 36 GND Ground. Reference potential. Note: For the capability of driving the full current at the outputs all pins of GND must be externally connected. 6, 7, 14, 15, 23, 24, 29, 32 VS Power supply voltage (external reverse protection required). For EMI reason a ceramic capacitor as close as possible to GND is recommended. Note: for the capability of driving the full current at the outputs all pins of VS must be externally connected. 3, 4, 34 OUT1 Half-bridge output 1. The output is built by a high side and a low side switch, which are internally connected. The output stage of both switches is a power DMOS transistor. Each driver has an internal reverse diode (bulk-drain- diode: high side driver from output to VS, low side driver from GND to output). This output is over-current and open-load protected. Note: for the capability of driving the full current at the outputs all pins of OUT1 must be externally connected. 8 DI Serial data input. The input requires CMOS logic levels and receives serial data from the microcontroller. The data is a 16bits control word and the least significant bit (LSB, bit 0) is transferred first. |
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