Package and PCB thermal data

L99MOD51XP

28/33

DS12667 Rev 6

6

Package and PCB thermal data

6.1

PowerSSO-36 thermal data

Figure 10. PowerSSO-36 2 layer PCB

Figure 11. PowerSSO-36 4 layer PCB

Note:

double layer and four layers, board dimension 129 mm x 60 mm, board material FR4, Cu

thickness 0.070 mm (outer layers), Cu thickness 0.035 mm (inner layers), thermal vias

separation 1.2 mm, thermal via diameter 0.3 mm ±0.08 mm, Cu thickness on vias

0.025 mm, footprint dimension 4.1 mm x 6.5 mm). 4-layer PCB: Cu on mid1 and mid2 layer:

contributor.