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STELPD01 数据表(PDF) 5 Page - STMicroelectronics |
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STELPD01 数据表(HTML) 5 Page - STMicroelectronics |
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5 / 27 page ![]() 4 Maximum ratings Table 3. Absolute maximum ratings Symbol Parameter Value Unit VIN Power supply input voltage -0.3 to 23.5 V VOUT Output voltage -0.3 to VIN + 0.3 V ILIM Current limit resistor pin voltage -0.3 to 23.5 V EN/Fault EN/Fault pin voltage -0.3 to 7 V dV/dt dV/dt pin voltage -0.3 to 7 V VG External gate driver pin voltage -0.3 to 23.5 V TJ-OP Operating junction temperature range (1) -40 to 125 °C TJ-MAX Maximum junction temperature 125 °C TSTG Storage temperature range -55 to 150 °C TLEAD Lead temperature (soldering) 10 sec 260 °C 1. The thermal limit is set above the maximum thermal rating. It is not recommended to operate the device at temperatures greater than the maximum ratings for extended periods. Note: Absolute maximum ratings are those values beyond which damage to the device may occur. Functional operation under these conditions is not implied. All values are referred to GND. Table 4. Thermal data Symbol Parameter Value Unit RthJA Thermal resistance junction-ambient (1) 53 °C/W RthJC Thermal resistance junction-case 18 °C/W 1. Based on JESD51-7, 4-layer PCB. Table 5. ESD performance Symbol Parameter Test conditions Value Unit ESD ESD protection voltage HBM 2 kV CDM 500 V Table 6. Recommended operating condition Symbol Parameter Value Unit VIN Operating power supply input voltage 4 to 16.8 V ID Maximum continuous current TA = 25 °C (1) 5 A CIN Minimum input capacitor 1 µF COUT Minimum output capacitor 1 µF 1. The maximum allowable power dissipation is a function of the maximum junction temperature TJ(MAX), the junction-to- ambient thermal resistance θJA, and the ambient temperature TA and can be estimated by: PD(MAX) = (TJ(MAX)-TA) / θJA. Exceeding the maximum allowable power dissipation produces overheating that may cause thermal shutdown. STELPD01 Maximum ratings DS13254 - Rev 1 page 5/27 |
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