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LARA-R6401D 数据表(PDF) 35 Page - u-blox AG |
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LARA-R6401D 数据表(HTML) 35 Page - u-blox AG |
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35 / 41 page ![]() LARA-R6 series - Data sheet UBX-21004391 - R09 Product handling & soldering Page 35 of 41 C1-Public Parameter Typical value Tolerance Unit A0 24.9 0.2 mm B0 26.8 0.2 mm K0 3.5 0.2 mm Table 36: LARA-R6 series modules tape dimensions ☞ 10 sprocket hole pitch cumulative tolerance ± 0.2 mm. ☞ Pocket position relative to sprocket hole measured as true position of pocket, not pocket hole. ☞ A0 and B0 are measured on a plane at a distance “R” above the bottom of the pocket. 7.2 Moisture sensitivity levels ⚠ LARA-R6 series modules are Moisture Sensitive Devices (MSD) in accordance to the IPC/JEDEC specification. The Moisture Sensitivity Level (MSL) relates to the packaging and handling precautions required. LARA-R6 series modules are rated at MSL level 4. For more information regarding moisture sensitivity levels, labeling, storage and drying see the u-blox package information user guide [4]. ☞ For the MSL standard, see IPC/JEDEC J-STD-020 (can be downloaded from www.jedec.org). 7.3 Reflow soldering Reflow profiles are to be selected according to u-blox recommendations (see the system integration manual [2]). ⚠ Failure to observe these recommendations can result in severe damage to the device! 7.4 ESD precautions ⚠ LARA-R6 series modules contain highly sensitive electronic circuitry and are Electrostatic Sensitive Devices (ESD). Handling LARA-R6 series modules without proper ESD protection may destroy or damage them permanently. LARA-R6 series modules are Electrostatic Sensitive Devices (ESD) and require special ESD precautions typically applied to ESD sensitive components. Table 9 details the maximum ESD ratings of the LARA-R6 series modules. Proper ESD handling and packaging procedures must be applied throughout the processing, handling and operation of any application that incorporates the LARA-R6 series module. ESD precautions should be implemented on the application board where the module is mounted, as described in the system integration manual [2]. ⚠ Failure to observe these recommendations can result in severe damage to the device! |
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