STTH302S

3/5

0.0

0.5

1.0

1.5

2.0

2.5

3.0

0.0

0.5

1.0

1.5

2.0

2.5

3.0

3.5

I

(A)

F(AV)

P

(W)

F(AV)

T

tp

δ = 0.05 δ

= 0.1

δ = 0.2

δ = 0.5

δ = 1

Fig. 1: Average forward power dissipation versus

average forward current.

0.0

0.5

1.0

1.5

2.0

2.5

3.0

3.5

0

25

50

75

100

125

150

175

T

(°C)

amb

R

R

S=1cm²

I

(A)

F(AV)

Fig. 2: Average forward current versus ambient

temperature (

δ = 0.5)

0.0

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0.8

0.9

1.0

1.E-01

1.E+00

1.E+01

1.E+02

1.E+03

tp(s)

T

tp

Zth(j-a)/Rth(j-a)

δ = 0.5

δ = 0.2

δ = 0.1

Single pulse

Fig. 3: Relative variation of thermal impedance

junction ambient versus pulse duration (Printed

circuit board epoxy FR4).

10

100

1

10

100

1000

V (V)

R

F=1MHz

V

T

C(pF)

Fig. 5: Junction capacitance versus reverse

voltage applied (typical values).

0.1

1.0

10.0

100.0

0.0

0.2

0.4

0.6

0.8

1.0

1.2

1.4

1.6

1.8

2.0

2.2

2.4

V

(V)

FM

T

(Maximum values)

T

(Maximum values)

T

(Maximum values)

T

(Typical values)

T

(Typical values)

I

(A)

FM

Fig. 4:

Forward voltage drop versus forward

current.

0

10

20

30

40

50

60

70

80

90

100

1

10

100

1000

dI /dt(A/µs)

F

I

V

T

T

t

(ns)

RR

confidence).