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ADRF5032BCCZN-R7 数据表(PDF) 5 Page - Analog Devices

部件名 ADRF5032BCCZN-R7
功能描述  1 GHz to 60 GHz, Reflective, Silicon SPDT Switch
PDF  11 Pages
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制造商  AD [Analog Devices]
网页  http://www.analog.com
标志 AD - Analog Devices

ADRF5032BCCZN-R7 数据表(HTML) 5 Page - Analog Devices

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Data Sheet
ADRF5032
ABSOLUTE MAXIMUM RATINGS
analog.com
Rev. 0 | 5 of 11
For the recommended operating conditions, see Table 1.
Table 2. Absolute Maximum Ratings
Parameter
Rating
Positive Supply Voltage
-0.3 V to +3.6 V
Negative Supply Voltage
−3.6 V to +0.3 V
Digital Control Input1
Voltage
−0.3 V to VDD + 0.3 V
Current
3 mA
RF Input Power2 (f = 3 GHz to 67 GHz, TCASE =
85°C3)
Through Path
24.5 dBm
Hot Switching (RFC)
21.5 dBm
RF Input Power, Unbiased
(VDD, VSS = 0V)
15 dBm
Temperature
Junction, TJ
135°C
Storage Range
−65°C to +150°C
Reflow
260°C
1 Overvoltages at the digital control input are clamped by internal diodes.
Current must be limited to the maximum rating given.
2 For power derating over frequency, see Figure 2.
3 For 105°C operation, the power handling degrades from the TCASE = 85°C
specification by 3 dB.
Stresses at or above those listed under Absolute Maximum Ratings
may cause permanent damage to the product. This is a stress
rating only; functional operation of the product at these or any other
conditions above those indicated in the operational section of this
specification is not implied. Operation beyond the maximum operat-
ing conditions for extended periods may affect product reliability.
Only one absolute maximum rating can be applied at any one time.
THERMAL RESISTANCE
Thermal performance is directly linked to printed circuit board
(PCB) design and operating environment. Careful attention to PCB
thermal design is required.
θJC is the junction-to-case bottom (channel-to-package bottom)
thermal resistance.
Table 3. Thermal Resistance
Package Type
θJC1
Unit
CC-12-07, Through Path
476
°C/W
1 θJC was determined by simulation under the following conditions: the heat
transfer is due solely to the thermal conduction from the channel through the
ground pad to the PCB, and the ground pad is held constant at the operating
temperature of 85°C.
POWER DERATING CURVES
Figure 2. Power Derating vs. Frequency, Low-Frequency Detail, TCASE = 85°C.
ELECTROSTATIC DISCHARGE (ESD) RATINGS
The following ESD information is provided for handling of ESD-sen-
sitive devices in an ESD-protected area only.
Human body model (HBM) per ANSI/ESDA/JEDEC JS-001. Charg-
ed device model (CDM) ratings are per ANSI/ESDA/JEDEC
JS-002.
ESD Ratings for the ADRF5032
Table 4. ADRF5032, 20-Terminal LGA
ESD Model
Withstand Threshold (V)
HBM
±750 for RF Pins
±2000 for Supply and Digital Control Pins
CDM
±500 for All Pins
ESD CAUTION
ESD (electrostatic discharge) sensitive device. Charged devi-
ces and circuit boards can discharge without detection. Although
this product features patented or proprietary protection circuitry,
damage may occur on devices subjected to high energy ESD.
Therefore, proper ESD precautions should be taken to avoid
performance degradation or loss of functionality.



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