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ADRF5032BCCZN-R7 数据表(PDF) 5 Page - Analog Devices |
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ADRF5032BCCZN-R7 数据表(HTML) 5 Page - Analog Devices |
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5 / 11 page ![]() Data Sheet ADRF5032 ABSOLUTE MAXIMUM RATINGS analog.com Rev. 0 | 5 of 11 For the recommended operating conditions, see Table 1. Table 2. Absolute Maximum Ratings Parameter Rating Positive Supply Voltage -0.3 V to +3.6 V Negative Supply Voltage −3.6 V to +0.3 V Digital Control Input1 Voltage −0.3 V to VDD + 0.3 V Current 3 mA RF Input Power2 (f = 3 GHz to 67 GHz, TCASE = 85°C3) Through Path 24.5 dBm Hot Switching (RFC) 21.5 dBm RF Input Power, Unbiased (VDD, VSS = 0V) 15 dBm Temperature Junction, TJ 135°C Storage Range −65°C to +150°C Reflow 260°C 1 Overvoltages at the digital control input are clamped by internal diodes. Current must be limited to the maximum rating given. 2 For power derating over frequency, see Figure 2. 3 For 105°C operation, the power handling degrades from the TCASE = 85°C specification by 3 dB. Stresses at or above those listed under Absolute Maximum Ratings may cause permanent damage to the product. This is a stress rating only; functional operation of the product at these or any other conditions above those indicated in the operational section of this specification is not implied. Operation beyond the maximum operat- ing conditions for extended periods may affect product reliability. Only one absolute maximum rating can be applied at any one time. THERMAL RESISTANCE Thermal performance is directly linked to printed circuit board (PCB) design and operating environment. Careful attention to PCB thermal design is required. θJC is the junction-to-case bottom (channel-to-package bottom) thermal resistance. Table 3. Thermal Resistance Package Type θJC1 Unit CC-12-07, Through Path 476 °C/W 1 θJC was determined by simulation under the following conditions: the heat transfer is due solely to the thermal conduction from the channel through the ground pad to the PCB, and the ground pad is held constant at the operating temperature of 85°C. POWER DERATING CURVES Figure 2. Power Derating vs. Frequency, Low-Frequency Detail, TCASE = 85°C. ELECTROSTATIC DISCHARGE (ESD) RATINGS The following ESD information is provided for handling of ESD-sen- sitive devices in an ESD-protected area only. Human body model (HBM) per ANSI/ESDA/JEDEC JS-001. Charg- ed device model (CDM) ratings are per ANSI/ESDA/JEDEC JS-002. ESD Ratings for the ADRF5032 Table 4. ADRF5032, 20-Terminal LGA ESD Model Withstand Threshold (V) HBM ±750 for RF Pins ±2000 for Supply and Digital Control Pins CDM ±500 for All Pins ESD CAUTION ESD (electrostatic discharge) sensitive device. Charged devi- ces and circuit boards can discharge without detection. Although this product features patented or proprietary protection circuitry, damage may occur on devices subjected to high energy ESD. Therefore, proper ESD precautions should be taken to avoid performance degradation or loss of functionality. |
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