www.statschippac.com

FEATURES

• Combining devices into one package reduces PCB real

estate and cost

• Increased sub-system performance by integrating

multiple chips into a single package

• Die to die bonding capability for device/signal

integration

• Standard and green/lead-free materials and Pb-free

plating

• Options for mixed technologies, 2 or more stacked dice

• Fine pitch bonding capability

• Exposed pad provides enhanced thermal performance

• Low profile package thickness of 1.40mm (LQFP-SD and

LQFP-ep-SD); 1.00mm (TQFP-ep-SD)

• Lead pitch ranges from 0.80mm to 0.40mm

• Pin count ranges from 32 to 208 leads (LQFP-SD), 64 to

216 leads (LQFP-ep-SD), 32 to 100 leads (TQFP-ep-SD)

• JEDEC standard compliant package outlines

• Stacking of die enables more functionality and

integration in a conventional QFP package

DESCRIPTION

STATS ChipPAC’s Stacked Die QFP offering includes LQFP-

SD, LQFP-ep-SD and TQFP-ep-SD. LQFP-SD is a stacked die

low profile QFP. LQFP-ep-SD is an exposed pad version that

provides enhanced thermal performance. TQFP-ep-SD is a

thin profile exposed pad version with enhanced thermal

performance. STATS ChipPAC’s chip stacking technology

allows the integration of multiple ICs within a single

package to improve package performance and functionality

while reducing overall package size and cost. The die to die

wire bonding capability enables device/signal integration

to improve electrical performance and reduce overall

package I/O requirements. STATS ChipPAC’s Stacked Die

QFPs with nominal package thickness of 1.40mm and

1.00mm are suitable for a variety of product applications.

Stacked Die QFP packages are currently available in LQFP,

LQFP-ep and TQFP-ep configurations, and are offered in

standard and green/lead-free bill of materials.

QFP-SD

Stacked Die Quad Flat Pack

APPLICATIONS

Suitable for a variety of applications including memory

integration (ASIC or Logic), chipset integration (Analog/

Digital), mixed technologies integration (Baseband/RF),

handheld products (Cellular Phones, Pagers, MP3 Players,

GPS), consumer electronics (Internet applications, Digital

Cameras/Camcorders), computers (Network PCs), and PC

peripherals (Disk Drivers, CD-R/RW, DVD Drivers).