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©2016 Integrated Device Technology, Inc

Revision B November 16, 2016

831724 Datasheet

Power Considerations

This section provides information on power dissipation and junction temperature for the 831724.

Equations and example calculations are also provided.

1.

Power Dissipation.

The total power dissipation for the 831724 is the sum of the core power plus the power dissipated at the output(s).

The following is the power dissipation for VDD = 3.3V ± 0.3V = 3.6V, which gives worst case results.

NOTE: Please refer to Section 3 for details on calculating power dissipated at the output(s).

Total PowerMAX = VDD_MAX * (IDD_MAX) = 3.6V * 128mA = 460.8mW

2. Junction Temperature.

Junction temperature, Tj, is the temperature at the junction of the bond wire and bond pad, and directly affects the reliability of the device. The

maximum recommended junction temperature is 125°C. Limiting the internal transistor junction temperature, Tj, to 125°C ensures that the bond

wire and bond pad temperature remains below 125°C.

The equation for Tj is as follows: Tj =



JA * Pd_total + TA

Tj = Junction Temperature



JA = Junction-to-Ambient Thermal Resistance

Pd_total = Total Device Power Dissipation (example calculation is in section 1 above)

TA = Ambient Temperature

In order to calculate junction temperature, the appropriate junction-to-ambient thermal resistance



JA must be used. Assuming no air flow and

a multi-layer board, the appropriate value is 37.0°C/W per Table 6 below.

Therefore, Tj for an ambient temperature of 85°C with all outputs switching is:

85°C + 0.4608W *37.0°C/W = 102.05°C. This is below the limit of 125°C.

This calculation is only an example. Tj will obviously vary depending on the number of loaded outputs, supply voltage, air flow and the type of

board (multi-layer).

Table 6. Thermal Resistance JA for 32 Lead VFQFN, Forced Convection



JA vs. Air Flow

Meters per Second

01

2.5

Multi-Layer PCB, JEDEC Standard Test Boards

37.0°C/W

32.4°C/W

29.0°C/W