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©2016 Integrated Device Technology, Inc

Revision B November 16, 2016

831724 Datasheet

Package Outline and Package Dimensions

Package Outline - K Suffix for 32 Lead VFQFN

Table 8. Package Dimensions

Reference Document: JEDEC Publication 95, MO-220

The package mechanical drawing shown is a generic drawing that

applies to any pin count VFQFN package. This drawing is not

intended to convey the actual pin count or pin layout of this device.

The pin count and pin-out are shown on the front page. The package

dimensions are in Table 8.

To p View

Ind exArea

D

Chamfer 4x

0.6 x 0.6 max

OPTIONAL

Anvil

Singula tion

A

0. 08

C

C

A3

A1

S eating Plan e

E2

E2

2

L

(N

-1)x e

(R ef.)

(Ref.)

N & N

Even

N

e

D2

2

D2

(Ref.)

N & N

Odd

1

2

e

2

(Ty p.)

If N & N

are Even

(N -1)x e

(Re f.)

b

Th er mal

Ba se

N

OR

Anvil

Singulation

N-1

N

CHAMFER

1

2

N-1

1

2

N

RADIUS

4

4

Bottom View w/Type C ID

Bottom View w/Type A ID

There are 2 methods of indicating pin 1 corner at the back of the VFQFN package:

1. Type A: Chamfer on the paddle (near pin 1)

2. Type C: Mouse bite on the paddle (near pin 1)

JEDEC Variation: VHHD-2/-4

All Dimensions in Millimeters

Symbol

Minimum

Nominal

Maximum

N

32

A

0.80

1.00

A1

00.05

A3

0.25 Ref.

b

0.18

0.25

0.30

ND & NE

8

D & E

5.00 Basic

D2 & E2

3.0

3.3

e

0.50 Basic

L

0.30

0.40

0.50