DocID029059 Rev 1

7/23

STGIPL30C60

Electrical ratings

2.2

Thermal data

Table 5. Total system

Symbol

Parameter

Value

Unit

VISO

Isolation withstand voltage applied between each

pin and heatsink plate (AC voltage, t = 60 s)

2500

V

Tj

Power chip operating junction temperature

-40 to 150

°C

TC

Module case operation temperature

-40 to 125

°C

Table 6. Thermal data

Symbol

Parameter

Value

Unit

Rth(j-c)

Thermal resistance junction-case single IGBT

2.2

°C/W

Thermal resistance junction-case single diode

5

°C/W

Figure 3. Maximum IC(RMS) current vs switching

frequency(1)

Figure 4. Maximum IC(RMS) current vs fsine

(1)

1.

Simulated curves refer to typical IGBT parameters and maximum Rthj-c.