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ILPS28QSW 数据表(PDF) 12 Page - STMicroelectronics |
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ILPS28QSW 数据表(HTML) 12 Page - STMicroelectronics |
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12 / 52 page ![]() 5.4 Device structure The ILPS28QSW has a unique cylindrical package solution with a full metal lid assembled on ceramic substrate and this cylindrical package provides an easy assembly with O-rings in the end user’s application. Figure 5. ILPS28QSW internal structure This structure (Figure 5) is designed and verified to resist water pressure up to 10 ATM and the potting gel in the ILPS28QSW has been proven to protect electronic components from long-term exposure to harsh environments such as water mixed with chlorine, bromine, commercial washing detergent and fuels, solvents and chemicals. It also provides excellent low-stress encapsulation performance for sensitive electronic components from severe environmental conditions such as high temperature and humidity, refer to the properties of the gel that are given in the following table. Table 10. Potting gel properties Properties Potting gel Permeability g/m2·24 hr 7 Hardness (penetration) based on ASTM D1403 70 Ultralow Young's modulus Less than 0.01 GPa TCE (thermal coefficient of expansion) 300 ppm/°C ILPS28QSW Device structure DS13905 - Rev 1 page 12/52 |
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