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HTMS8301FUG/AM 数据表(PDF) 33 Page - NXP Semiconductors |
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HTMS8301FUG/AM 数据表(HTML) 33 Page - NXP Semiconductors |
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33 / 44 page ![]() 184430 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved. Product data sheet PUBLIC Rev. 3.0 — 18 March 2010 184430 33 of 44 NXP Semiconductors HITAG µ ISO 18000 transponder IC 16. Limiting values [1] Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any conditions other than those described in the Operating Conditions and Electrical Characteristics section of this specification is not implied. [2] This product includes circuitry specifically designed for the protection of its internal devices from the damaging effects of excessive static charge. Nonetheless, it is suggested that conventional precautions should be taken to avoid applying values greater than the rated maxima 17. Characteristics [1] Typical ratings are not guaranteed. Values are at 25 °C . [2] Measured with an HP4285A LCR meter at 125 kHz/room temperature (25 °C) [3] Integrated Resonance Capacitor: 210pF ±3% [4] Integrated Resonance Capacitor: 280pF ±5% Table 33. Limiting values[1][2] In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter Conditions Min Max Unit Tstg storage temperature −55 +125 °C VESD electrostatic discharge voltage JEDEC JESD 22-A114-AB Human Body Model ±2- kV Ii(max) maximum input current IN1-IN2 −±20 mApeak Tj junction temperature −40 +85 °C Table 34. Characteristics Symbol Parameter Conditions Min Typ Max Unit foper operating frequency 100 125 150 kHz VIN1-IN2 input voltage 456Vpeak II input current IN1-IN2 - - ±10 mApeak Ci input capacitance between IN1-IN2 VIN1-IN2 = 0.5 Vrms [2][3] 203.7 210 216.3 pF Ci input capacitance between IN1-IN2 VIN1-IN2 = 0.5 Vrms [2][4] 266 280 294 pF |
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