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HTMS8301FUG/AM 数据表(PDF) 36 Page - NXP Semiconductors |
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HTMS8301FUG/AM 数据表(HTML) 36 Page - NXP Semiconductors |
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36 / 44 page ![]() 184430 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved. Product data sheet PUBLIC Rev. 3.0 — 18 March 2010 184430 36 of 44 NXP Semiconductors HITAG µ ISO 18000 transponder IC Fig 16. Package outline HVSON2 REFERENCES OUTLINE VERSION EUROPEAN PROJECTION ISSUE DATE IEC JEDEC JEITA SOT899-1 SOT899-1 05-02-25 05-05-09 Note 1. Plastic or metal protrusions of 0.75 mm maximum per side are not included UNIT A max mm 1 0.05 0 2.1 1.9 1.35 1.05 3.1 2.9 1.35 1.05 0.5 0.3 A1 DIMENSIONS (mm are the original dimensions) HVSON2: plastic thermal enhanced very thin small outline package; no leads; 2 terminals; body 3 × 2 × 0.85 mm D 0.9 0.7 b Dh E Eh e 2.5 L y1 0.1 v 0.1 w 0.05 y 0.05 01 2 mm scale C y C y1 X detail X A A1 B A D E terminal 1 index area b e A C B ∅ v M C ∅ w M Dh 1 2 L Eh terminal 1 index area |
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