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HTMS8301FUG/AM 数据表(PDF) 35 Page - NXP Semiconductors |
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HTMS8301FUG/AM 数据表(HTML) 35 Page - NXP Semiconductors |
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35 / 44 page ![]() 184430 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved. Product data sheet PUBLIC Rev. 3.0 — 18 March 2010 184430 35 of 44 NXP Semiconductors HITAG µ ISO 18000 transponder IC 19. Package outline Fig 15. Package outline SOT1122 References Outline version European projection Issue date IEC JEDEC JEITA sot1122 Unit m max nom min 0.50 0.04 0.55 0.425 0.30 0.25 0.22 0.35 0.30 0.27 A(1) mensions tes Dimension A is including plating thickness. Can be visible in some manufacturing processes. A1 D 1.50 1.45 1.40 1.05 1.00 0.95 Ee e1 0.55 0.50 0.47 0.45 0.40 0.37 bb1 LL1 D E e1 e A1 b1 L1 L e1 0 1 2 mm scale 3 1 2 b 4 × (2) 4 × (2) A pin 1 indication type code terminal 1 index area |
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