ADN2530YCPZ-R2 datasheet(14/20 Pages) AD

14 / 20 page

ADN2530

Rev. A | Page 14 of 20

θJ-TOP

TPAD

TTOP

θJ-PAD

TPAD

A compact optical module is a complex thermal environment,

and calculations of device junction temperature using the

package θJA (junction-to-ambient thermal resistance) do not

yield accurate results. The following equation, derived from the

model in Figure 38, can be used to estimate the IC junction

temperature:

(

)

TOP

PAD

TOP

PAD

TOP

PAD

−

Figure 38. Electrical Model for Thermal Calculations

where:

TTOP and TPAD can be determined by measuring the temperature

at points inside the module, as shown in Figure 37. The thermo-

couples should be positioned to obtain an accurate measurement of

the package top and paddle temperatures. θJ-TOP and θJ-PAD are

given in Table 2.

TTOP is the temperature at top of package in degrees Celsius.

TPAD is the temperature at package exposed paddle in degrees

Celsius.

TJ is the IC junction temperature in degrees Celsius.

P is the ADN2530 power dissipation in watts.

θJ-TOP is the thermal resistance from IC junction to package top.

θJ-PAD is the thermal resistance from IC junction to package

exposed pad.

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