PowerPC 602 RISC Microprocessor Hardware Specifications

21

1.6.2.2 Mechanical Dimensions of the IBM PQFP Package

Figure 11 shows the mechanical dimensions for the IBM wire-bond PQFP package.

Figure 11. Mechanical Dimensions of the IBM Wire-Bond PQFP Package

Min.

Max.

A

27.80 28.20

B

30.95 31.35

C

0.65 BSC

D

0.20

0.40

E

3.9

4.5

F

0.25

0.45

G

0.65

0.95

H

0.10

0.20

J1

°

7

°

A

*Not to scale

E

Notes:

1. BSC—Between Standard Centers.

2. All measurements in mm.

G

F

Pin 144

B

Pin 1

CD

H

J

PRELIMINARY

Freescale Semiconductor, Inc.

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