PowerPC 602 RISC Microprocessor Hardware Specifications

5

1.2 General Parameters

The following list provides a summary of the general parameters of the 602.

Technology

CMOS (four-level metal)

Die size

7.07 mm x 7.07 mm

Processor performance

66.67 MHz, 80 MHz

Package

Surface mount, 144-pin plastic quad flat pack (PQFP)

Power supplies

3.3 V (

± 10% V dc)

1.3 Electrical and Thermal Characteristics

This section provides both the AC and DC electrical specifications and thermal characteristics for the 602.

The following specifications are preliminary and subject to change without notice.

1.3.1 DC Electrical Characteristics

Table 1, Table 2, and Table 3 provide the absolute maximum rating and thermal characteristics for the 602.

Table 1. Absolute Maximum Ratings

Characteristic

Symbol

Value

Unit

Core Supply voltage

Vdd

–0.3 to 4.0

V

I/O Supply voltage

OVdd

–0.3 to 4.0

V

PLL Supply voltage

AVdd

–0.3 to 4.0

V

Input voltage

Vin

–0.3 to 5.5

V

Storage temperature range

Tstg

–55 to 150

°C

Notes:

1. Functional operating conditions are given in AC and DC electrical specifications. Stresses beyond

the maximums listed may affect device reliability or cause permanent damage to the device.

2. Caution: Input voltage must not be greater than the supply voltage by more than 2.5 V at all times

including during power-on reset.

Table 2. Recommended Operating Conditions

Characteristic

Symbol

Value

Unit

Core Supply voltage

Vdd

2.97 to 3.63

V

I/O Supply voltage

OVdd

2.97 to 3.63

V

PLL Supply voltage

AVdd

2.97 to 3.63

V

Input voltage

Vin

GND to 5.5

V

Freescale Semiconductor, Inc.

For More Information On This Product,

Go to: www.freescale.com