6

PowerPC 602 RISC Microprocessor Hardware Specifications

Table 4 provides the DC electrical characteristics for the 602.

Junction Temperature

TJ

0 to 105

°C

Notes:

1. These are the recommended and tested operating conditions. Proper device operation outside of these

conditions is not guaranteed.

2. Caution: Vin must not exceed OVdd by more than 2.5 V at all times, including during power-on reset.

3. Caution: OVdd must not exceed Vdd by more than 2.5 V at all times, including during power-on reset.

4. Caution: Vdd/Avdd must not exceed OVdd by more than 0.4 V at all times, including during power-on

reset.

Table 3. Thermal Characteristics

Characteristic

Symbol

Value

Rating

Motorola PQFP package thermal resistance, junction-to-case (typical)

θJC

2.8

°C/W

IBM PQFP package thermal resistance, junction-to-case (typical)

θJC

2.8

°C/W

Notes:

1. TJ = TA + PD X θJA where θJA = θJC + θCA

2. Refer to Section 1.7, “System Design Information,” for more information about thermal management.

Table 4. DC Electrical Specifications

Vdd = 3.3

± 10% V dc, GND = 0 V dc

Characteristic

Symbol

Min

Max

Unit

Input high voltage (all inputs except SYSCLK)

VIH

2

5.5

V

Input low voltage (all inputs except SYSCLK)

VIL

GND

0.8

V

SYSCLK input high voltage

CVIH

2.4

5.5

V

SYSCLK input low voltage

CVIL

GND

0.4

V

Input leakage current, Vin = 3.63 V

1,2

Iin

—10

µA

Output three-state leakage, Vin = 3.63 V

2

ITSO

—10

µA

Bidirectional three-state leakage, Vin = 3.63 V

3

ITSB

—

500

µA

Output high voltage, IOH = -9mA

VOH

2.4

—

V

Output low voltage, IOL = 9 mA

VOL

—

0.4

V

Table 2. Recommended Operating Conditions

Characteristic

Symbol

Value

Unit

Freescale Semiconductor, Inc.

For More Information On This Product,

Go to: www.freescale.com