TLK2201A, TLK2201AI

ETHERNET TRANSCEIVERS

SLLS572 – JUNE 2003

10

POST OFFICE BOX 655303

Terminal Functions (Continued)

TERMINAL

I/O

DESCRIPTION

NAME

NO.

I/O

DESCRIPTION

GROUND

GNDA

51,58

Ground

Analog ground. GNDA provides a ground for the high-speed analog circuits, RX and TX.

GND

1, 14, 21,

25, 33, 46

Ground

Digital logic ground. Provides a ground for the logic circuits and digital I/O buffers.

GNDPLL

64

Ground

PLL ground. Provides a ground for the PLL circuitry.

–0.3 V to 3 V

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

–0.5 V to 4 V

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Input voltage range at any other terminal

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

– 65

°C to 150°C

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Electrostatic discharge

CDM: 1 kV, HBM:2 kV

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Characterized free-air operating temperature range

0

°C to 70°C

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Characterized free-air operating temperature range: TLK2201A

0

°C to 70°C

. . . . . . . . . . . . . . . . . . . . . . . . . . . .

TLK2201AI

–40

°C to 85°C

. . . . . . . . . . . . . . . . . . . . . . . . .

† Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and

functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not

implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

NOTE 1: All voltage values, except differential I/O bus voltages, are with respect to network ground terminal.

DISSIPATION RATING TABLE

PACKAGE

TA ≤ 25°C

POWER RATING

OPERATING FACTOR‡

ABOVE TA = 25°C

TA = 70°C

POWER RATING

RCP64§

5.25 W

46.58 mW/

°C

2.89 W

RCP64¶

3.17 W

23.70 mW/

°C

1.74 W

RCP64#

2.01 W

13.19 mW/

°C

1.11 W

‡ This is the inverse of the traditional junction-to-ambient thermal resistance (RθJA).

§ 2 oz. Trace and copper pad with solder.

¶ 2 oz. Trace and copper pad without solder.

# Standard JEDEC high-K board

NOTE:

For more information, refer to TI application note PowerPAD Thermally Enhanced

Package, TI literature number SLMA002.

thermal characteristics

PARAMETER

TEST CONDITION

MIN

TYP

MAX

UNIT

Board-mounted, no air flow, high conductivity TI

recommended test board, chip soldered or greased to

thermal land

21.47

R

θJA

Junction-to-free-air thermal resistance

Board-mounted, no air flow, high conductivity TI

recommended test board with thermal land but no

solder or grease thermal connection to thermal land

42.20

°C/W

Board-mounted, no air flow, JEDEC test board

75.83

Board-mounted, no air flow, high conductivity TI

recommended test board, chip soldered or greased to

thermal land

0.38

R

θJC Junction-to-case-thermal resistance

Board-mounted, no air flow, high conductivity TI

recommended test board with thermal land but no

solder or grease thermal connection to thermal land

0.38

°C/W

Board-mounted, no air flow, JEDEC test board

7.8