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ADCMP606 数据表(PDF) 6 Page - Analog Devices |
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ADCMP606 数据表(HTML) 6 Page - Analog Devices |
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6 / 16 page ![]() ADCMP606/ADCMP607 Preliminary Technical Data Rev. PrA | Page 6 of 16 PIN CONFIGURATION AND FUNCTION DESCRIPTIONS PIN 1 INDICATOR 1 VCCO 2 VCCI 3 VEE 9VEE 8LE/HYS 7SDN TOP VIEW (Not to Scale) ADCMP607 Q 1 VEE 2 VP 3 Q 6 VCCI/VCCO 5 VN 4 ADCMP606 TOP VIEW (Not to Scale) Figure 3. ADCMP606 Pin Configuration Figure 4. ADCMP607 Pin Configuration Table 4. ADCMP606 (SC70-6) Pin Function Descriptions Pin No. Mnemonic Description 1 Q Noninverting Output. Q is at logic high if the analog voltage at the noninverting input, VP, is greater than the analog voltage at the inverting input, VN. 2 VEE Negative Supply Voltage. 3 VP Noninverting Analog Input. 4 VN Inverting Analog Input. 5 V /V CCI CCO Input Section Supply/Output Section Supply. Shared pin. 6 Q Inverting Output. Q is at logic low if the analog voltage at the noninverting input, VP, is greater than the analog voltage at the inverting input, VN. Table 5. ADCMP607 (LSCFP-12) Pin Function Descriptions Pin No. Mnemonic Description 1 V Output Section Supply. CCO 2 VCCI Input Section Supply. 3 VEE Negative Supply Voltage. 4 VP Noninverting Analog Input. 5 VEE Negative Supply Voltage. 6 VN Inverting Analog Input. 7 SDN Shutdown. Drive this pin low to shut down the device. 8 LE/HYS Latch/Hysteresis Control. Bias with resistor or current for hysteresis adjustment; drive low to latch. 9 VEE Negative Supply Voltage. 10 Q Inverting Output. Q is at logic low if the analog voltage at the noninverting input, VP, is greater than the analog voltage at the inverting input, VN, provided that the comparator is in compare mode. 11 VEE Negative Supply Voltage. 12 Q Noninverting Output. Q is at logic high if the analog voltage at the noninverting input, VP, is greater than the analog voltage at the inverting input, VN, provided that the comparator is in compare mode. V Heat Sink Paddle The metallic back surface of the package is electrically connected to V EE EE . It can be left floating because Pin 3, Pin 5, Pin 9, and Pin 11 provide adequate electrical connection. It can also be soldered to the application board if improved thermal and/or mechanical stability is desired. |
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