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CS5421 数据表(PDF) 8 Page - ON Semiconductor |
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CS5421 数据表(HTML) 8 Page - ON Semiconductor |
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8 / 14 page ![]() CS5421 http://onsemi.com 8 3. output voltage change due to the ESR and ESL of the bulk and high frequency decoupling capacitors, circuit traces, and vias; 4. output voltage ripple and noise. Budgeting the tolerance is left up to the designer who must take into account all of the above effects and provide an output voltage that will meet the specified tolerance at the load. The designer must also ensure that the regulator component temperatures are kept within the manufacturer’s specified ratings at full load and maximum ambient temperature. Selecting Feedback Divider Resistors Figure 6. Selecting Feedback Divider Resistors VOUT R1 R2 VFB The feedback pins (VFB1(2)) are connected to externalresistor dividers to set the output voltages. The error amplifier is referenced to 1.0 V and the output voltage is determined by selecting resistor divider values. Resistor R1 is selected based on a design trade−off between efficiency and output voltage accuracy. The output voltage error can be estimated due to the bias current of the error amplifier neglecting resistor tolerance: Error% + 1 10*6 R1 1.0 100% R2 can be sized after R1 has been determined: R2 + R1 VOUT 1.0 * 1.0 Calculating Duty Cycle The duty cycle of a buck converter (including parasitic losses) is given by the formula: Duty Cycle + D + VOUT ) (VHFET ) VL) VIN ) VLFET * VHFET * VL where: VOUT = buck regulator output voltage; VHFET = high side FET voltage drop due to RDS(ON); VL = output inductor voltage drop due to inductor wire DC resistance; VIN = buck regulator input voltage; VLFET = low side FET voltage drop due to RDS(ON). Figure 7. Switching Frequency 10 20 30 40 50 60 100 200 300 400 500 600 700 800 ROSC (kW) Selecting the Switching Frequency Selecting the switching frequency is a trade−off between component size and power losses. Operation at higher switching frequencies allows the use of smaller inductor and capacitor values. Nevertheless, it is common to select lower frequency operation because a higher frequency results in lower efficiency due to MOSFET gate charge losses. Additionally, the use of smaller inductors at higher frequencies results in higher ripple current, higher output voltage ripple, and lower efficiency at light load currents. The value of the oscillator resistor is designed to be linearly related to the switching period. If the designer prefers not to use Figure 7 to select the necessary resistor, the following equation quite accurately predicts the proper resistance for room temperature conditions. ROSC + 21700 * fSW 2.31fSW where: ROSC = oscillator resistor in kΩ; fSW = switching frequency in kHz. Selection of the Output Inductor The inductor should be selected based on its inductance, current capability, and DC resistance. Increasing the inductor value will decrease output voltage ripple, but degrade transient response. There are many factors to consider in selecting the inductor including cost, efficiency, EMI and ease of manufacture. The inductor must be able to handle the peak current at the switching frequency without saturating, and the copper resistance in the winding should be kept as low as possible to minimize resistive power loss. There are a variety of materials and types of magnetic cores that could be used for this application. Among them are ferrites, molypermalloy cores (MPP), amorphous and powdered iron cores. Powdered iron cores are very commonly used. Powdered iron cores are very suitable due |
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