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LPC804 数据表(PDF) 72 Page - NXP Semiconductors |
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LPC804 数据表(HTML) 72 Page - NXP Semiconductors |
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72 / 89 page ![]() LPC804 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2023. All rights reserved. Product data sheet Rev. 2.1 — 25 July 2023 72 of 87 NXP Semiconductors LPC804 32-bit Arm Cortex-M0+ microcontroller 16. Package outline Fig 35. Package outline SOT360-1 (TSSOP20) UNIT A1 A2 A3 bp cD (1) E (2) (1) eHE LLp QZ y w v θ REFERENCES OUTLINE VERSION EUROPEAN PROJECTION ISSUE DATE IEC JEDEC JEITA mm 0.15 0.05 0.95 0.80 0.30 0.19 0.2 0.1 6.6 6.4 4.5 4.3 0.65 6.6 6.2 0.4 0.3 0.5 0.2 8 0 o o 0.13 0.1 0.2 1 DIMENSIONS (mm are the original dimensions) Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic interlead protrusions of 0.25 mm maximum per side are not included. 0.75 0.50 SOT360-1 MO-153 99-12-27 03-02-19 w M b p D Z e 0.25 110 20 11 pin 1 index θ A A1 A2 L p Q detail X L (A ) 3 HE E c v M A X A y 0 2.5 5 mm scale TSSOP20: plastic thin shrink small outline package; 20 leads; body width 4.4 mm SOT360-1 A max. 1.1 |
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