The information contained herein is exclusive property of. Do not copy and print except that Attend accepts.

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SOLDER ABILITY

Item

Requirement

Test Condition

Solder ability

95%of immersed area

must show no voids , pin

holes.

Dip solder tails into the molten solder(held at

230±5℃) up to 0.5mm from the tip of tails for

3±0.5 seconds.

(MIL-STD-202 METHOD 208)

Resistance to

soldering heat

No melting, cracks or

functional damage

allowed

All connectors designed for PCB soldering within

this specification must be able to withstand the

heat from solder oven according to the graph

below. The cycle should be repeated twice.

(MIL-STD-202 METHOD 210)

Peak temperature: 260℃ 5Sec

Soldering temperature: 230℃

Preheating temperature: 150-180℃