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104H-TDA0-R01 数据表(PDF) 2 Page - ATTEND Technology Inc. |
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104H-TDA0-R01 数据表(HTML) 2 Page - ATTEND Technology Inc. |
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2 / 4 page ![]() The information contained herein is exclusive property of. Do not copy and print except that Attend accepts. 本文件係屬立威科技股份有限公司所有;非經同意,不得以任何覆寫、拷貝、翻印等方式私自據有。亦不得擅加毀損、塗改。 -2 - Dielectric Withstanding Voltage No breakdown Mate connectors; apply 500V AC (rms.) between two adjacent for 1 minute. (Trip current:1mA) (MIL-STD-202 METHOD 301) MECHANICAL Item Requirement Test Condition Contact Retention Force 2.5N per pin (Min.) Place a connector on the push-pull machine, then apply a force on a contact head and push the contact to the opposite direction of the contact insertion at the speed of 25 ± 3mm/min. (EIA364-29) Durability No Damage Contact Resistance: 100mΩ(Max) Solder connectors on PCB, then place them on the pull-push machine, and repeat mating and un-mating 10,000cycles repeatedly at a rate of 400~600 cycles/hour. (EIA364-09) Vibration No electrical discontinuity more than 0.1μs. Contact Resistance: 100mΩ(Max) Mate dummy card and subject to the following vibration conditions, for a period of 30 minutes in each of 3 mutually perpendicular axis, passing DC 1 mA during the test. Amplitude: 1.52 mm P-P or 19.6 m/s2 Frequency: 10-55-10Hz Shall be traversed in 1minute. (MIL-STD-202 METHOD 201) Shock No electrical discontinuity more than 0.1μs. Contact Resistance: 100mΩ(Max) Solder connectors on PCB and mate them together, subject to he following shock conditions, 3 shocks shall be period along 3 mutually perpendicular axis, passing DC 1mA current during the test. 1 axis, plus-minus direction, core 3times.(total:18times) 490m/s2 (MIL-STD-202 METHOD 213) Card Insertion / Eject Force 9.8N Max Push the card at the speed rate 25 ± 3mm/minute. Card Release Force 6N~9N From the state of the card lock, Pull the card at the speed rate 25 ± 3mm/minute. Push in strength No Damage The card inserted in positive and the opposite direction and the load of 30N is added |
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