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-3 -

ENVIRONMENTAL

Item

Requirement

Test Condition

Temperature Cycle

Contact Resistance:

100mΩ(Max)

Insulation Resistance:

100MΩ(Min)

Stage Temp

Time

t1

-55℃

30 min

t2

-55~+90℃ 3 min

t3

+ 90℃

30 min

t4

+90~-55℃

3 min

Test time: 6 cycles

(JIS C0025)

Heat Resistance

Contact Resistance:

100mΩ(Max)

Insulation Resistance:

100MΩ(Min)

Solder connectors on PCB and mate them

together, expose to 90 ± 20C for 96hrs. Upon

completion of the exposure period, the test

specimens shall be conditioned at ambient room

conditions for 1 of 2hrs, after which the specified

measurements shall be performed.

(MIL-STD-202 METHOD 108)

Cold Resistance

Contact Resistance:

100mΩ(Max)

Insulation Resistance:

100MΩ(Min)

Solder connectors on PCB and mate them

together, expose to -55 ± 30C for 96hrs. Upon

completion of the exposure period, the test

specimens shall be conditioned at ambient room

conditions for 1 of 2hrs, after which the specified

measurements shall be performed.

(EIA364-59)

Humidity

Contact Resistance:

100mΩ(Max)

Insulation Resistance:

100MΩ(Min)

Humidity storage at +40ºC with 90~95% RH for

96 hours. Upon completion of the exposure

period,the test specimens shall be conditions for

1 of 2 hrs, then 10 mating cycles while.

(EIA364-31)

Salt Spray

Contact Resistance:

100mΩ(Max)

5 ± 1% salt solutions, at 35 ± 2ºC duration 48

hours. Connectors detached

(MIL-STD-1344)