SPECIFICATION AND PERFORMANCE

SERIES:

112J-TXAR-R01

FILE:

112J-TXAR-R01_spec

DATE:

2013/10/31

The information contained herein is exclusive property of. Do not copy and print except that Attend accepts.

本文件係屬立威科技股份有限公司所有；非經同意，不得以任何覆寫、拷貝、翻印等方式私自據有。亦不得擅加毀損、塗改。

-4 -

Temperature Cycle

Finish

1. Contact

Resistance:

80mΩ (Max)

2. Insulation

Resistance:

100MΩ (Min)

Stage Temp

Time

t1

-55℃

30 min

t2

-55~+90 ℃

3 min

t3

+ 90 ℃

30 min

t4

+90~-55 ℃

3 min

Test time: 6 cycles

(JIS C0025)

Heat Resistance

Finish

1. Contact

Resistance:

80mΩ (Max)

2. Insulation

Resistance:

100MΩ (Min)

Solder connectors on PCB and mate them

together, expose to 90 ± 20℃ for 96hrs. Upon

completion of the exposure period, the test

specimens shall be conditioned at ambient

room conditions for 1 of 2hrs, after which the

specified measurements shall be performed.

(MIL-STD-202 METHOD 108)

Cold Resistance

Finish

1. Contact

Resistance:

80mΩ (Max)

2. Insulation

Resistance:

100MΩ (Min)

Solder connectors on PCB and mate them

together, expose to -55 ± 30C for 96hrs.

Upon completion of the exposure period, the

test specimens shall be conditioned at

ambient room

conditions for 1 of 2hrs, after which the

specified measurements shall be performed.

(EIA364-59)

Salt Spray

Finish

1. Contact

Resistance:

80mΩ (Max)

2 .No Damage

5 ± 1% salt solutions, at 35 ± 2ºC duration

48 hours. Connectors detached

(MIL-STD-1344)