SPECIFICATION AND PERFORMANCE

SERIES:

112J-TXAR-R01

FILE:

112J-TXAR-R01_spec

DATE:

2013/10/31

The information contained herein is exclusive property of. Do not copy and print except that Attend accepts.

本文件係屬立威科技股份有限公司所有；非經同意，不得以任何覆寫、拷貝、翻印等方式私自據有。亦不得擅加毀損、塗改。

-5 -

SOLDER ABILITY

Item

Requirement

Test Condition

Solder ability

95%of immersed

area must show no

voids , pin holes.

Dip solder tails into the molten solder(held at

230±5℃) up to 0.5mm from the tip of tails for

3±0.5 seconds.

(MIL-STD-202 METHOD 208)

Resistance to

soldering heat

No melting, cracks

or functional

damage allowed

All connectors designed for PCB soldering

within this specification must be able to

withstand the heat from solder oven

according to the graph below. The cycle

should be repeated twice.

(MIL-STD-202 METHOD 210)

Peak temperature: 260℃

Soldering temperature: 230℃

Preheating temperature: 150-180℃