ST7LITE0X datasheet(113/125 Pages) STMICROELECTRONICS

113 / 125 page

ST7LITE0x, ST7LITESx

113/125

14.3 SOLDERING INFORMATION

In accordance with the RoHS European directive,

all STMicroelectronics packages will be converted

in 2005 to lead-free technology, named ECO-

PACKTM (for a detailed roadmap, please refer to

PCN CRP/04/744 "Lead-free Conversion Program

- Compliance with RoHS", issued November 18th,

2004).

■ ECOPACK

TM packages are qualified according

to the JEDEC STD-020C compliant soldering

profile.

■ Detailed information on the STMicroelectronics

ECOPACKTM transition program is available on

www.st.com/stonline/leadfree/,

with

specific

technical Application notes covering the main

technical

aspects

lead-free

conversion

(AN2033,

AN2034,

AN2035,

AN2036).

Backward and forward compatibility:

The main difference between Pb and Pb-free sol-

dering process is the temperature range.

– ECOPACKTM TQFP, SDIP and SO packages

are fully compatible with Lead (Pb) containing

soldering process (see application note AN2034)

– TQFP, SDIP and SO Pb-packages are compati-

ble with Lead-free soldering process, neverthe-

less it's the customer's duty to verify that the Pb-

packages maximum temperature (mentioned on

the Inner box label) is compatible with their Lead-

free soldering temperature.

Table 20. Soldering Compatibility (wave and reflow soldering process)

* Assemblers must verify that the Pb-package maximum temperature (mentioned on the Inner box label)

is compatible with their Lead-free soldering process.

Package

Plating material devices

Pb solder paste

Pb-free solder paste

SDIP & PDIP

Sn (pure Tin)

Yes

Yes *

QFN

Sn (pure Tin)

Yes

Yes *

TQFP and SO

NiPdAu (Nickel-palladium-Gold)

Yes

Yes *

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