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SIM800C 数据表(PDF) 47 Page - SIMCom |
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SIM800C 数据表(HTML) 47 Page - SIMCom |
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47 / 52 page ![]() Smart Machine Smart Decision SIM800C_Hardware_Design_V1.02 47 2015-4-27 7.3. The Moisture Sensitivity Level The moisture sensitivity level of SIM800C module is 3. The modules should be mounted within 168 hours after unpacking in the environmental conditions of temperature <30℃ and relative humidity of <60% (RH). It is necessary to bake the module if the above conditions are not met: Table 40: Moisture sensitivity level and floor life Moisture Sensitivity Level (MSL) Floor Life (out of bag) at factory ambient≤30°C/60% RH or as stated 1 Unlimited at ≦30℃/85% RH 2 1 year 2a 4 weeks 3 168 hours 4 72 hours 5 48 hours 5a 24 hours 6 Mandatory bake before use. After bake, it must be reflowed within the time limit specified on the label. NOTES: For product handling, storage, processing, IPC / JEDEC J-STD-033 must be followed. 7.4. Baking Requirements SIM800C modules are vacuum packaged, and guaranteed for 6 months storage without opening or leakage under the following conditions: the environment temperature is lower than 40℃, and the air humidity is less than 90%. If the condition meets one of the following ones shown below, the modules should be baked sufficiently before re-flow soldering, and the baking condition is shown in below table; otherwise the module will be at the risk of permanent damage during re-flow soldering. If the vacuum package is broken or leakage; If the vacuum package is opened after 6 months since it’s been packed; If the vacuum package is opened within 6 months but out of its Floor Life at factory ambient≦30℃ /60%RH or as stated. Table 41: Baking requirements Baking temperature Moisture Time 40 ±5 ℃℃ <5% 192 hours 120 ±5 ℃℃ <5% 6 hours Note: Care should be taken if that plastic tray is not heat-resistant, the modules should be taken out for preheating, otherwise the tray may be damaged by high-temperature heating. |
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