ADCMP580/ADCMP581/ADCMP582

Rev. 0 | Page 14 of 16

OUTLINE DIMENSIONS

1

0.50

BSC

0.60 MAX

PIN 1

INDICATOR

1.50 REF

0.50

0.40

0.30

0.25 MIN

0.45

2.75

BSC SQ

TOP

VIEW

12° MAX

0.80 MAX

0.65 TYP

SEATING

PLANE

PIN 1

INDICATOR

0.90

0.85

0.80

0.30

0.23

0.18

0.05 MAX

0.02 NOM

0.20 REF

3.00

BSC SQ

*1.65

1.50 SQ

1.35

16

5

13

8

9

12

4

EXPOSED

PAD

(BOTTOM VIEW)

*COMPLIANT TO JEDEC STANDARDS MO-220-VEED-2

EXCEPT FOR EXPOSED PAD DIMENSION.

Figure 30. 16-Lead Lead Frame Chip Scale Package [LFCSP_VQ]

(CP-16-3)

Dimensions shown in millimeters

ORDERING GUIDE

Model

Temperature Range

Package Description

Package Option

Branding

ADCMP580BCP-WP

−40°C to +125°C

16-LEAD LFCSP-VQ

CP-16-3

GO7

ADCMP580BCP–R2

−40°C to +125°C

16-LEAD LFCSP-VQ

CP-16-3

GO7

ADCMP580BCP–RL7

−40°C to +125°C

16-LEAD LFCSP-VQ

CP-16-3

GO7

ADCMP581BCP-WP

−40°C to +125°C

16-LEAD LFCSP-VQ

CP-16-3

GO9

ADCMP581BCP–R2

−40°C to +125°C

16-LEAD LFCSP-VQ

CP-16-3

GO9

ADCMP581BCP–RL7

−40°C to +125°C

16-LEAD LFCSP-VQ

CP-16-3

GO9

ADCMP582BCP-WP

−40°C to +125°C

16-LEAD LFCSP-VQ

CP-16-3

GOB

ADCMP582BCP-R2

−40°C to +125°C

16-LEAD LFCSP-VQ

CP-16-3

GOB

ADCMP582BCP-RL7

−40°C to +125°C

16-LEAD LFCSP-VQ

CP-16-3

GOB

EVAL-ADCMP580BCP

Evaluation Board

EVAL-ADCMP581BCP

Evaluation Board

EVAL-ADCMP582BCP

Evaluation Board